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Difference Between Lead-free and Lead-based Process for PCBA

1. Cost

In the lead-free processing of PCBA, due to the characteristics of the solder itself, some auxiliary materials are needed for welding, and the use of lead-free solder paste in reflow soldering increases the cost of using lead-free solder paste by two times. At the same time, the use of tin wires and bars in the wave soldering process also increases the processing cost by at least two times, resulting in a higher cost of lead-free processing;


2. Firmness

The melting point temperature of lead-free solder used in the lead-free processing is 217 ℃, which requires a higher temperature. However, the melting point temperature of lead-based solder is 183 ℃, because the melting point of lead-based solder is lower, it causes less thermal damage to electronic components. After processing, the solder joints are also brighter, harder, and of better quality;


3. Environmental Friendliness

The lead element contained in lead solder poses a significant threat to human health, and long-term exposure has a significant impact on human health. Meanwhile, the widespread use of lead-free processing technology in the international market is also a form of environmental protection, as people have become aware of the increasingly serious environmental pollution problems that pose a threat to them.


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